AppliedLogix was tasked with developing an electronics enclosure that would withstand the thermal and mechanical stresses, including the vibrational loading during launch, that results from being placed in a zero-G earth orbit aboard a space launch vehicle. The enclosure design needed to support multiple interconnected printed circuit board (PCB) assemblies, while meeting stringent electromagnetic compatibility (EMC) standards, and providing robust connector mounting for customer harnessing between modules and test apparatus.
A machined aluminum enclosure was developed. The unique design supported the top down assembly of the boards onto their respective enclosure compartments. The top cover, mezzanine board bottom cover, and the baseplate all required heatsinking features that were used in conjunction with thermal gap pads to conduct heat off the boards.
Once the two sub-assemblies were pre-assembled, the housing and baseplate were constructed in a manner to provide the structural support needed to oppose the mating forces of the high-density connectors during assembly.
The assembly cover with thermal gap pads along with the end cover were installed last. These enclosure elements were designed to physically protect, electrically isolate, and thermally dissipate heat from the FPGA components installed on both the mezzanine and motherboards.